The Generic Compatible OSFP transceiver supports up to 10km link lengths over single-mode fiber (SMF) with MTP/MPO-16 connectors. This transceiver is compliant with IEEE 802.3ck, IEEE 802.3cu-2021 and CMIS Rev 5.0 standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet, Data Center, Breakout 2x 400G PLR4 or 8x 100G LR application.
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Arista Networks OSFP-800G-2PLR4 Compatible OSFP 800GBASE-PLR8 PAM4 1310nm 10km DOM MPO-16/APC SMF Optical Transceiver Module, Finned Top, Support 2 x 400G-PLR4 and 8 x 100G-LR
Neu #229661
Neu #229661
2.972,62 € (inkl. MwSt.)
FS P/N: OSFP800-PLR8-B1
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800GBASE-PLR8 OSFP Optical Transceiver Module (SMF, 1310nm, 10km, MTP/MPO-16, DOM)
Specifications
Part Number
OSFP800-PLR8-B1
Vendor Name
FS
Form Factor
OSFP
Max Data Rate
850Gbps (8x 106.25Gbps)
Wavelength
1310nm
Max Cable Distance
10km
Connector
MTP/MPO-16
Media
SMF
Transmitter Type
EML
Receiver Type
SiPhotonics PIN PD
TX Power
-1.9~4.8dBm
Minimum Receiver Power
-8.2dBm
Powerbudget
6.3dB
Receiver Overload
4.8dBm
Typical Power Consumption
16.5W
Extinction Ratio
>3.5dB
Packaging Technology
COB (Chip on Board) Packaging
Modulation Format
PAM4
CDR (Clock and Data Recovery)
TX and RX Built-in DSP
Inbuilt FEC
No
Protocols
CMIS Rev 5.0, IEEE 802.3ck, IEEE 802.3cu-2021
Warranty
5 Years
Qualitätszertifizierungen
Um die detaillierte Zertifizierung zu erhalten, besuchen Sie bitte das Compliance Center.
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Anwendungslösung
Merkmale
Leading Performance and Quality for 800G
Built-in Broadcom DSP Chip, the OSFP transceiver offers high-speed, and low-power in 800G links.
Broadcom 7nm DSP Chip
Stable Transmission
Low Power Consumption
≤16.5W
EML Laser
Ensure Production
Center Wavelength | 1310nm | 1310nm | 1310nm | 1271nm, 1291nm, 1311nm and 1331nm |
Connector | MTP/MPO-16 | MTP/MPO-16 | Dual MTP/MPO-12 | Dual LC Duplex |
Cable Distance (Max.) | 10km | 10km | 10km | 10km |
Modulation | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 |
Transmitter Type | EML | EML | EML | EML |
Packaging Technology | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging |
Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip |
Power Consumption | ≤16.5W | ≤18W | ≤16.5W | ≤18W |
Application | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G |
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J***a
United States
29.01.2023
Fast shipping and delivery, I will keep a close eye on these type of products.
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Kommentar 0N***d
Canada
09.01.2023
We wanted a higher speed network system and needed to choose some transceivers, we didn't need a long transmission distance, so this type was just right for us. They proved to have excellent connectivity, and all metrics were within normal limits.
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Kommentar 0G***s
United States
14.12.2022
We've communicate with several companies before and they were not able to offer enough amount we expected. But FS.com did it. Would like to do business again with them.
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